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SIPC42S2N08 Datasheet - Infineon Technologies AG

SIPC42S2N08 OptiMOS Chip data sheet

* Assembly by epoxy die bonding or soldering * AQL 1.5 for visual inspection according to failure catalog A67207-A7001-A001 issue C on 100% measured wafer * Storage of chips and wafer according technical guideline 14 Doc. No. A66003-R14-T1-B-35 VDS RDS(on) Die size Thickness.

SIPC42S2N08_InfineonTechnologiesAG.pdf

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Datasheet Details

Part number:

SIPC42S2N08

Manufacturer:

Infineon ↗ Technologies AG

File Size:

90.37 KB

Description:

Optimos chip data sheet.

SIPC42S2N08 Distributor

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SIPC42S2N08 SIPC42S2N08 OptiMOS Chip data sheet Infineon Technologies AG