DF75R12W1H4F_B11 Datasheet - Infineon

DF75R12W1H4F_B11 IGBT

DF75R12W1H4F_B11 EasyPACK Modul und PressFIT / NTC EasyPACK module and PressFIT / NTC J Typische Anwendungen Solar Anwendungen Elektrische Eigenschaften CoolSiC (TM) Schottky Diode Gen 5 Niedrige Schaltverluste Mechanische Eigenschaften 3 kV AC 1min Isolationsfestigkeit Al2O3 Substrat mit kleinem thermischen Widerstand Integrierter NTC Temperatur Sensor Kompaktes Design PressFIT Verbindungstechnik VCES = 1200V IC n.

DF75R12W1H4F_B11 Features

* CoolSiC (TM) Schottky diode gen 5

* Low switching losses Mechanical Features

* 3 kV AC 1min insulation

* Al2O3 substrate with low thermal resistance

* Integrated NTC temperature sensor

* Compact design

* PressFIT contact technology Module La

DF75R12W1H4F_B11 Datasheet (693.08 KB)