Description
T1
T3
T5
TS1
TS2
T2
T4
T6
TS3
Datasheet www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.00 2024-03-14
FS01MR08A8MA2LBC
HybridPACK™ Drive G2 module
Table of contents
Table of contents
Description
.
Features
- Electrical features
- VDSS = 750 V - IDN = 620 A - New semiconductor material - silicon carbide - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 175°C - Short-time extended operation temperature Tvj,op = 200 °C.
- Mechanical features - 4.2 kV DC 1 second insulation - High creepage and clearance distances - Compact design - High power density - Direct-cooled PinFin base plate - High-performance Si3N4 ceramic - Guiding elements for PCB and co.
FS01MR08A8MA2LBC-Infineon.pdf
