Description
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at any time, without notice.
Features
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* Flash Memory Plus SRAM
* Reduces Memory Board Space Required, Simplifying PCB Design Complexity SCSP Technology
* Smallest Memory Subsystem Footprint
* Area : 8 x 10 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or
Applications
* The C3 SCSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations. The C3 SCSP memory device offers a protection register and flexible block locking
