CCR75xxxx Datasheet | Kemet Corporation

.. CERAMIC MOLDED AXIAL & RADIAL PERFORMANCE CHARACTERISTICS Insulation Resistance: C0G - 10K megohms or 100 megohm - µF, whichever is less X7R - 10K megohms or 100 megohm - µF, whichever is less Dielectric Withstanding Voltage: 250% of rated voltage for 5 seconds with current limited to 50 m A. GENERAL Working Voltage: C0G - 50, 100 & 200 Volts X7R - 50, 100 & 200 Volts Temperature Characteristics: C0G - 0 ±30 PPM/°C from -55°C to +125°C X7R - ±15% from -55°C to +125°C Capacitance Tolerance: C0G - ±0.5 p F, ±1%, ±2%, ±5%, ±10%, ±20% (±0.5 p F is tightest available tolerance) X7R - ±10%, ±20%, -0 +100%, -20% +80% Construction: Monolithic block of ceramic dielectric with interdigitated internal electrodes, encapsulated in a molded case, and having axial or radial leads. Meets flame test requirements of UL Standard 94V-0. Terminal Strength: EIA-198 Method 303 Condition A (2.2 kg) ENVIRONMENTAL Moisture Resistance: MIL-STD-202, Method 106, or EIA-198, Method 204, Condition A, except 20 cycles. Insulation Resistance: C0G - 10K megohms or 100 megohm - µF, whichever is less X7R - 10K megohms or 100 megohm - µF, whichever is less Dielectric Withstanding Voltage: 250% of rated voltage for 5 seconds with current limited to 50 m A. Immersion Cycling: MIL-STD-202, Method 104, Condition B. Post-Test limits at 25°C are: Insulation Resistance: C0G - 10K megohms or 100 megohm - µF, whichever is less X7R - 10K megohms or 100 megohm - µF, whichever is less Solderability: MIL-STD-202, Method 208, Sn62 solder, 245°C for 5 ±1/2 seconds. Resistance to Soldering Heat: MIL-STD-202, Method 210, Condition B (260°C, 10 secs). Depth of immersion - to a minimum of .050" from the capacitor body. Lead Material: Axial: Solder-coated copper clad steel Radial: Solder-coated copper ELECTRICAL Capacitance: Within specified tolerance when measured with 1 volt rms at 1 k Hz (1000 p F or less at 1 MHz for C0G). Dissipation Factor: 25°C at 1 k Hz (1000 p F or less at 1 MHz for C0G). C0G - .15% maximum X7R -...