BZT52C30 Features
* Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg
Datasheet Details
BZT52C30, BZT52C2V0
Kexin
45.76 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: BZT52C30, BZT52C2V0.
Please refer to the document for exact specifications by model.
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