Description
The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging.
Features
- Ultra Low Cost.
- Most Advantaged Technology in Industry.
- Monolithically-Integrated Single Chip MEMS
Sensor with On-Chip Signal Processing.
- MEMSIC Proprietary Technology with No
Moving Parts.
- >200,000g Shock Survival Rating of Sensing
Structure.
- 12-bit Signal Output for X, Y and Z Axes.
- Full Scale Range ±2g, ±4g and ±8g.
- 8-bit Temperature Output (-50°C to +100°C).
- Smallest Wafer Level Package (WLP) Footprint
1.18mm×1.70mm×0.85mm.
- 6-Position Orient.