MTE8087T
Features
Ultra High Power Output Chip Size 1.0x1.0mm Four Wire Bonds on Die Corners Standard 3- lead TO- 39 Hermetic Package Two Catode Pins Must Be Externally Connected Together
Maximum Ratings (Ta=25 C)
Characteristic Forward Current Pulsed Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Junction Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tj Tsol Max. 500 10.00 5 1000.00
- 50 ~ +100
- 50 ~ +100 100 260 Test Condition Unit
- tw=10µ S, T=10m S
- -
- -
- for 3 sec. max m A A V m W o o
Data Shee
. o o
C C C o
Opto- Electrical Characteristics (Ta=25 C)
Characteristic Forward Voltage Reverse Current Power Output Half Intensity Beam Angle Peak Wavelength Spectral Line Half Width Symbol VF IR PO θ λp ∆λ Test Condition IF=300m A VR=5V IF=300m A
- IF=300m A IF=300m A Min
- -
- -
- - Typ 1.50
- 50.00 ± 45 o o
Max 2.00 10
- -
- -
Unit V µA m W deg. nm nm
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