* pin 9, Exposed Thermal Pad, and has the same pinout as the PDIP and SOIC packages. For further information on these differences and on the new models available, plea
TB3101
189.17 KB
Mcp2551 to mcp2561 migration.
TB3101
MCP2551 to MCP2561 Migration
Author: Wilhelm Leichtfried Microchip Technology Inc.
FIGURE 1:
PINOUT DIFFERENCES
MCP2551 PDIP, SOIC
MCP2561.
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