UMX812 Datasheet - Microchip

UMX812 MELF PIN Diodes

Surface Mount MELF PIN Diodes UMX502 UMX812 Product Overview This line of metal electrode leadless face (MELF) high power PIN diodes consists of hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations, which are ideal for surface mount and pick and place operations. The PIN diodes chips are coated with a special hard glass .

UMX812 Features

* Low

* magnetic (ideal for MRI applications)

* Very low inductance, full

* face bonding

* High

* reliability hermetic design

* Surface mount devices available in tape and reel

* RoHS compliant1

* ESD HMB Class 2 Package Styles Appl

UMX812 Datasheet (290.76 KB)