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UMX812, UMX502 Datasheet - Microchip

UMX812 - MELF PIN Diodes

Surface Mount MELF PIN Diodes UMX502 UMX812 Product Overview This line of metal electrode leadless face (MELF) high power PIN diodes consists of hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction.

The MELF ceramic package has square end terminations, which are ideal for surface mount and pick and place operations.

The PIN diodes chips are coated with a special hard glass

UMX812 Features

* Low

* magnetic (ideal for MRI applications)

* Very low inductance, full

* face bonding

* High

* reliability hermetic design

* Surface mount devices available in tape and reel

* RoHS compliant1

* ESD HMB Class 2 Package Styles Appl

UMX502-Microchip.pdf

This datasheet PDF includes multiple part numbers: UMX812, UMX502. Please refer to the document for exact specifications by model.
UMX812 Datasheet Preview Page 2 UMX812 Datasheet Preview Page 3

Datasheet Details

Part number:

UMX812, UMX502

Manufacturer:

Microchip ↗

File Size:

290.76 KB

Description:

Melf pin diodes.

Note:

This datasheet PDF includes multiple part numbers: UMX812, UMX502.
Please refer to the document for exact specifications by model.

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