Description
General Description
Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP.These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements.The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio.The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls).This bus a
Features
- NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family
Current production part numbers: See Table 1 on page 3
Features
Figure 1:
PoP Block Diagram.
- Micron® NAND Flash and Mobile LPDRAM components.
- RoHS-compliant, “green” package.
- Separate NAND Flash and Mobile LPDRAM interfaces.
- Space-saving package-on-package combination.
- Low-voltage operation (1.70.
- 1.95V).
- Industrial temperatur.