SM1002 Datasheet - Microsemi

SM1002 MELF PIN Diodes

This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are .

SM1002 Features

* Non-Magnetic1 Versions Ideal for MRI Applications

* Very Low Inductance, Full Face Bonding

* Hi-Rel Hermetic Design

* Surface Mount Devices Available in Tape and Reel

* RoHS Compliant2 Versions Available www.MICROSEMI.com APPLICATIONS The MELF diodes are used as switching, at

SM1002-Microsemi.pdf