CM100BU-12H - IGBT Module

Datasheet Summary

Description

Mitsubishi IGBT Modules are designed for use in switching applications.

Each module consists of four IGBTs in an H-Bridge configuration, with each transistor having a reverse-connected super-fast recovery free-wheel diode.

Features

ٗ Low Drive Power ٗ Low VCE(sat) ٗ Discrete Super-Fast Recovery Free-Wheel Diode ٗ High Frequency Operation ٗ Isolated Baseplate for Easy Heat Sinking.

Mitsubishi Electric Semiconductor

📥 Download Datasheet

Datasheet Details

Part number	CM100BU-12H
Manufacturer	Mitsubishi Electric Semiconductor
File Size	47.54 KB
Description	IGBT Module
Datasheet	CM100BU-12H Datasheet
Additional preview pages of the CM100BU-12H datasheet.

📁 Similar Datasheet

CM100BU-12H - IGBT Module (Powerex Power Semiconductors)
CM1000 - HIGH CURRENT SILICON BRIDGE RECTIFIERS (Pan Jit International Inc.)
CM1000 - HIGH CURRENT SILICON BRIDGE RECTIFIERS (TRSYS)
CM1000DU-34NF - IGBT Module (Mitsubishi Electric)
CM1000DX-24T - IGBT (Mitsubishi)
CM1000DXL-24S - IGBT (Mitsubishi)
CM1000DXP-24T - IGBT (Mitsubishi)
CM1000HA-24H - IGBT Module (Powerex Power Semiconductors)
CM1000HA-28H - IGBT Module (Powerex Power Semiconductors)
CM1000HA-34S - IGBT Modules (Mitsubishi)

Other Datasheets by Mitsubishi Electric Semiconductor

CM1000HA-24H - IGBT Module
CM1000HA-28H - IGBT Module
CM100DU-12H - IGBT MODULES
CM100DU-24H - IGBT MODULES
CM100DU-24NFH - IGBT MODULES
CM100DUS-12F - IGBT MODULES
CM100DY - IGBT Module
CM100DY-12H - IGBT Module

Full PDF Text Transcription

Click to expand full text

MITSUBISHI IGBT MODULES CM100BU-12H HIGH POWER SWITCHING USE INSULATED TYPE A B F E H E G R L S(4 - Mounting Holes) M GuP EuP D GvP EvP GuN EuN U V C TC Measured Point GvN EvN P TC Measured Point Q 4 - M4 NUTS J E J H K F G V T U N L TAB#110 t=0.5 V W X P Description: Mitsubishi IGBT Modules are designed for use in switching applications. Each module consists of four IGBTs in an H-Bridge configuration, with each transistor having a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.

Published: Mar 23, 2005 |