Datasheet4U Logo Datasheet4U.com

CM10MD3-12H - IGBT Module

Description

Powerex CI Modules are designed for use in switching applications.

Each module consists of a three phase diode converter section and a three phase IGBT inverter section.

Features

  • Low Drive Power.
  • Low VCE(sat).
  • Discrete Super-Fast Recovery (70ns) Free-Wheel Diodes.
  • High Frequency Operation (20-25 kHz).
  • Isolated Baseplate for Easy Heat Sinking.

📥 Download Datasheet

Datasheet preview – CM10MD3-12H

Datasheet Details

Part number CM10MD3-12H
Manufacturer Mitsubishi Electric Semiconductor
File Size 59.61 KB
Description IGBT Module
Datasheet download datasheet CM10MD3-12H Datasheet
Additional preview pages of the CM10MD3-12H datasheet.

📁 Similar Datasheet

  • CM10MD3-12H - IGBT Module (Powerex Power Semiconductors)
  • CM10MD-12H - IGBT Module (Powerex Power Semiconductors)
  • CM10MD-24H - IGBT Module (Powerex Power Semiconductors)
  • CM10MD1-12H - IGBT Module (Powerex Power Semiconductors)
  • CM10MD1-24 - IGBT Module (Powerex Power Semiconductors)
  • CM10MD1-24H - IGBT Module (Powerex Power Semiconductors)
  • CM10 - Molded Mini-DYAD (Clare Inc.)
  • CM1000 - HIGH CURRENT SILICON BRIDGE RECTIFIERS (Pan Jit International Inc.)
  • CM1000 - HIGH CURRENT SILICON BRIDGE RECTIFIERS (TRSYS)
  • CM1000DU-34NF - IGBT Module (Mitsubishi Electric)
Other Datasheets by Mitsubishi Electric Semiconductor

Full PDF Text Transcription

Click to expand full text
CM10MD1-24H Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272 CI Module Three Phase Converter + Three Phase Inverter 10 Amperes/1200 Volts A G J H (4 PLACES) H K K L L K L K K K K NOT CONNECTED K P1 A GU EU GV EV GW EW GU GV GW E C Q D R LABEL D Q U B F E R S T N U V W P S V "T" THICK W N H H P H H X 30° MAIN TERMINAL Y CONTROL TERMINAL K P1 Z Description: Powerex CI Modules are designed for use in switching applications. Each module consists of a three phase diode converter section and a three phase IGBT inverter section. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.
Published: |