EB346 Datasheet - Motorola Inc

EB346 Semiconductor Products Sector Engineering Bulletin

of the pinout change for the 144-pin TQFP package. Tolerant up to 3.6 V 144-pin TQFP or 196-pin PBGA Uses the following rules: For MF ≤ 4: CPCAP = [(680 × MF) * 120] pF For MF > 4: CPCAP = (1100 × MF) pF See Table 3 for details. Freescale Semiconductor, Inc I/O pins Package PLL input capac.

Freescale Semiconductor, Inc. MOTOROLA Semiconductor Products Sector Engineering Bulletin Order Number EB346/D: Rev. 2 4/20/2001 Functional Differences Between DSP56302 and DSP56309 (formerly DSP56302A) Contents 1 2 3 4 5 6 Purpose of this Document 1 Differences Overview 1 Input Power Changes 2 I/O Power Changes 4 PLL Input Capacitor (CPCAP) 4 Operating Modes 5 1 Freescale Semiconductor, Inc Purpose of this Document To meet the increasing demands for higher performance and lower power .

EB346 Features

* 3 Input Power Changes One method to increase the operating frequency of an integrated circuit is to “shrink” the die (that is, reduce the die dimensions, both linearly and vertically). Reducing the die size can yield additional benefits, such as a reduction of power consumption, but can also resu

EB346_MotorolaInc.pdf