EB346 - Semiconductor Products Sector Engineering Bulletin

Motorola Inc

EB346 Datasheet Preview — Preview of EB346 PDF

Datasheet Details

Part number	EB346
Manufacturer	Motorola Inc
File Size	246.73 KB
Description	Semiconductor Products Sector Engineering Bulletin
Datasheet	EB346_MotorolaInc.pdf

EB346 Product details

Description

of the pinout change for the 144-pin TQFP package. 120] pF For MF > 4: CPCAP = (1100 × MF) pF See Table 3 for details. 150] pF For MF > 4: CPCAP = (690 × MF) pF Operating modes Othe

Features

3 Input Power Changes One method to increase the operating frequency of an integrated circuit is to “shrink” the die (that is, reduce the die dimensions, both linearly and vertically). Reducing the die size can yield additional benefits, such as a reduction of power consumption, but can also result in other functional changes. The DSP56309 is a “shrink” of the DSP56302. This die size reduction enables the DSP56309 to achieve higher operating frequencies. Decreasing the die size, however, requ.

📁 EB346 Similar Datasheet

EB34 - Double Diode (Mullard)
EB33VD2 - Bi-Directional TVS Diode (Semtron)
EB33VD2-TRG - Bi-Directional TVS Diode (Semtron)
EB33VN5 - Low Capacitance Single-Line Bi-Directional ESD protection Diode (Semtron)
EB33VN5-TRG - Low Capacitance Single-Line Bi-Directional ESD protection Diode (Semtron)
EB35W1M - Bluetooth Stereo Audio Module (Gigawit)

Other Datasheets by Motorola Inc

Published: Apr 1, 2005 |