* printed circuit board to achieve a power dissipation of 2.0 Watts using the footprint shown. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using board material such as Thermal Clad, the power dissipation can be doubled using the same footpr
MMDF1N05E Datasheet (169.56 KB)
MMDF1N05E
Motorola
169.56 KB
Dual mosfet.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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