1. Excellent solderability characteristics are achieved via special plating techniques on each termination. 2. Specially designed substrate prevents wicking of flux onto the top of the part body. 3. Enlarged bottom termination enhance soldering strength while reducing the nocessary land area required promoting high-density PCB mounting. 4. Funnel shaped adjustment slot allows for in-process automatic adjustment. 5. Flat surface is provided for smooth pick and place. (PVZ3K only) 6. Heat-Resistan.