* (1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U.c0.6±0.1 .DataDirectional Inp
LDH311N50LAC-810 Datasheet (220.61 KB)
LDH311N50LAC-810
Murata Manufacturing
220.61 KB
Chip multilayer delay lines.
!Note
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