* (1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U.c0.6±0.1 .DataDirectional Inp
LDH322N50LAC-800 Datasheet (220.61 KB)
LDH322N50LAC-800
Murata Manufacturing
220.61 KB
Chip multilayer delay lines.
!Note
*PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmo.
📁 Related Datasheet
LDH322N00LAC-800 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH321N00LAC-800 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH321N50LAC-800 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH323N00LAC-800 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH32xxxx (LDH Series) Chip Multilayer Delay Lines (Murata Manufacturing)
LDH311N00LAC-810 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH311N50LAC-810 Chip Multilayer Delay Lines (Murata Manufacturing)
LDH312N00LAC-810 (LDH Series) Chip Multilayer Delay Lines (Murata Manufacturing)
LDH31xxxx (LDH Series) Chip Multilayer Delay Lines (Murata Manufacturing)
LDH40 200mA low dropout LDO (STMicroelectronics)
