* (1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U.c0.6±0.1 .DataDirectional Inp
LDHA26N00CAA-300 Datasheet (220.61 KB)
LDHA26N00CAA-300
Murata Manufacturing
220.61 KB
Chip multilayer delay lines.
!Note
*PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmo.
📁 Related Datasheet
LDHA210N0CAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA21N00BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA21N50BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA22N00BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA22N50BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA23N00BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA24N00BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA2500PAAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA25N00BAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
LDHA27N00CAA-300 Chip Multilayer Delay Lines (Murata Manufacturing)
