Ceramics +() Hard Glass and Silicone Resin(with phosphor) Encapsulating Resin Materials Silicone Resin Electrodes Materials Au-plated Weight 0.011g(TYP) * 。 Dimensions do not include mold flash. K A Protection Device 4 (2) 1.5 1.3 SOLDERING * Reflow Soldering Condition.
NICHIA STS-DA1-4895B NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NC2W170CT For Backlight LED Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant ISO/TS16949 Compliant SPECIFICATIONS NICHIA STS-DA1-4895B (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 1200 Pulse Forward Current IFP 1500 Allowable Reverse Current IR 85 Power Dissipation PD 8.52 Operating.