NVSA219BT - LED
Package Materials Encapsulating Resin Materials Electrodes Materials Lens Materials Die Heat Sink Materials Weight Ceramics () Silicone Resin (with phosphor) Au-plated Silicone Resin Au-plated 0.032g (TYP) KA Die Heat Sink Protection Device 4 0.4 1.2 1.9 3.3 0.5 SOLDERING <
NICHIA STS-DA1-2797A