Datasheet4U Logo Datasheet4U.com

HK3FF Datasheet - NINGBO

HK3FF SUBMINIATURE HIGH POWER RELAY

HK3FF Features

* For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 11V High temperature soldering guaranteed: 260°C / 10 seconds at terminals Plastic package has Underwriters Laborator

HK3FF Datasheet (227.22 KB)

Preview of HK3FF PDF
HK3FF Datasheet Preview Page 2 HK3FF Datasheet Preview Page 3

Datasheet Details

Part number:

HK3FF

Manufacturer:

NINGBO

File Size:

227.22 KB

Description:

Subminiature high power relay.

📁 Related Datasheet

HK3FF-DC12V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC24V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC3V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC48V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC5V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC6V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK3FF-DC9V SUBMINIATURE HIGH POWER RELAY (HUI KE)

HK31BP High-performance self-capacitance touch chip (ChipSourceTek)

TAGS

HK3FF SUBMINIATURE HIGH POWER RELAY NINGBO

HK3FF Distributor