Part number:
HK3FF
Manufacturer:
NINGBO
File Size:
227.22 KB
Description:
Subminiature high power relay.
* For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 11V High temperature soldering guaranteed: 260°C / 10 seconds at terminals Plastic package has Underwriters Laborator
HK3FF
NINGBO
227.22 KB
Subminiature high power relay.
📁 Related Datasheet
HK3FF-DC12V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC24V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC3V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC48V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC5V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC6V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK3FF-DC9V SUBMINIATURE HIGH POWER RELAY (HUI KE)
HK31BP High-performance self-capacitance touch chip (ChipSourceTek)
HK3S03B INTELLIGENT PASSIVE TRANSMITTER (MORNSUN)
HK-002 (HK-xxx) 10/100 BASE-T LAN COMPONENTS (E-Tronic)
