Datasheet4U Logo Datasheet4U.com

BCP51 - PNP medium power transistors

Datasheet Summary

Description

PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

Table 1.

[1] Valid for all available selection groups.

Features

  • High current.
  • Three current gain selections.
  • High power dissipation capability.
  • Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061).
  • Leadless very small SMD plastic package with medium power capability (SOT1061).
  • AEC-Q101 qualified 1.3.

📥 Download Datasheet

Datasheet preview – BCP51

Datasheet Details

Part number BCP51
Manufacturer NXP
File Size 196.20 KB
Description PNP medium power transistors
Datasheet download datasheet BCP51 Datasheet
Additional preview pages of the BCP51 datasheet.

📁 Similar Datasheet

  • BCP51 - PNP Silicon AF Transistors (Infineon Technologies AG)
  • BCP51 - 1A PNP medium power transistors (nexperia)
  • BCP51 - PNP General Purpose Amplifier (Fairchild Semiconductor)
  • BCP51 - PNP MEDIUM POWER TRANSISTORS (Diodes)
  • BCP51-10 - PNP Silicon AF Transistors (Infineon Technologies AG)
  • BCP51-10T - 1A PNP medium power transistors (nexperia)
  • BCP51-16 - PNP Silicon AF Transistors (Infineon Technologies AG)
  • BCP51-16T - 1A PNP medium power transistors (nexperia)
  • BCP51-C - PNP Transistor (SeCoS)
  • BCP5110TA - PNP MEDIUM POWER TRANSISTORS (Diodes)
Other Datasheets by NXP
  • BCP51-16 - PNP medium power transistors
  • BCP52 - PNP medium power transistors
  • BCP52-16 - PNP medium power transistors
  • BCP53 - PNP medium power transistors
  • BCP53-10 - PNP medium power transistors
  • BCP53-16 - PNP medium power transistors
  • BCP54 - NPN medium power transistors
  • BCP54-16 - NPN medium power transistors

Full PDF Text Transcription

Click to expand full text
BCP51; BCX51; BC51PA 45 V, 1 A PNP medium power transistors Rev. 9 — 13 October 2011 Product data sheet 1. Product profile 1.1 General description PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP BCP51 SOT223 BCX51 SOT89 BC51PA SOT1061 JEITA SC-73 SC-62 - [1] Valid for all available selection groups. JEDEC TO-243 - NPN complement BCP54 BCX54 BC54PA 1.2 Features and benefits  High current  Three current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.
Published: |