BY228 Datasheet - NXP

BY228 Damper diode

Rugged glass package, using a high temperature alloyed construction. BY228 This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol. , a MAM104 LIMITING VALUES In accor.

BY228 Features

* Glass passivated

* High maximum operating temperature

* Low leakage current

* Excellent stability

* Available in ammo-pack

* Also available with preformed leads for easy insertion. APPLICATIONS

* Damper diode in high frequency horizontal defl

BY228_PhilipsSemiconductors.pdf