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BY228 Datasheet - NXP

BY228 - Damper diode

Rugged glass package, using a high temperature alloyed construction.

BY228 This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol.

, a MAM104 LIMITING VALUES In accor

BY228 Features

* Glass passivated

* High maximum operating temperature

* Low leakage current

* Excellent stability

* Available in ammo-pack

* Also available with preformed leads for easy insertion. APPLICATIONS

* Damper diode in high frequency horizontal defl

BY228_PhilipsSemiconductors.pdf

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Datasheet Details

Part number:

BY228

Manufacturer:

NXP ↗

File Size:

52.12 KB

Description:

Damper diode.

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