Datasheet Details
- Part number
- BY558
- Manufacturer
- NXP ↗
- File Size
- 66.23 KB
- Datasheet
- BY558_PhilipsSemiconductors.pdf
- Description
- Damper diodes
BY558 Description
DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D333 BY558; BY578 Damper diodes Product speciļ¬cation File under Discrete Semiconductors, S.
Rugged glass package, using a high temperature alloyed construction.
BY558 Features
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Also available with preformed leads for easy insertion
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