BY558 Datasheet - NXP

BY558 Damper diodes

Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig.1 Simplified outline (SOD115) and symbol. LIMITING VALUES In accordance with the Absolute Maximum .

BY558 Features

* Glass passivated

* High maximum operating temperature

* Low leakage current

* Excellent stability

* Also available with preformed leads for easy insertion

* Designed to withstand transients up to 1700 V. APPLICATIONS

* For use in multi-sync m

BY558_PhilipsSemiconductors.pdf