MF1ICS5005 Datasheet (NXP) - Standard Card IC

MF1ICS5005, Standard Card IC

3.0 August 2004 - Initital version.

6 PUBLIC Philips Semiconductors - a worldwide company Contact Information For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.phil

www.DataSheet4U.com INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors Product Specification Rev.

3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE 3 REFERENCE DOCUMENTS 3 Philips Documents 3 MECHANICAL SPECIFICATION 3 Wafer 3 Wafer Backside