SOT416 Datasheet (NXP) - Package outline

SOT416, Package outline

Philips Semiconductors Package outline Plastic surface mounted package; 3 leads SOT416 D B E A X v M A HE 3 Q A 1 e1 e bp 2 w M B A1 c Lp detail X 0 0.5 scale 1 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.95 0.60 A1 max 0.1 bp 0.30 0.15 c 0.25 0.10 D 1.8 1.4 E 0.9 0.7 e 1 e1 0.5 HE 1.75 1.45 Lp 0.45 0.15 Q 0.23 0.13 v 0.2 w 0.2 OUTLINE VERSION SOT416 REFERENCES IEC JEDEC JEITA SC-75 EUROPEAN PROJECTION ISSUE DATE 97-02-28 04-11-04 SOT416 © Koninklijke Ph