Description
Top View
6
5
4
Bottom View
4
5
6
∗
6
5
4
(mark side)
1
2
3
3
2
1
DFN1212-6 Pin Configuration
1
2
3
SOT-23-6 Pin Configuration
DFN1212-6 Pin Description
Pin No.Symbol
Description
1
VOUT1
Output Pin 1
2
VOUT2
Output Pin2
3
GND
Ground Pin
4
CE2
Chip Enable Pin 2, Active-high
5
VDD
Input Pin
6
CE1
Chip Enable Pin 1, Active-high
∗ The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level).I
Features
- allow the RP152x to become ideal power sources for hand-held communication equipment. The RP152x is offered in a 6-pin SOT-23-6 package and a 6-pin DFN1212-6 package. Both packages are equipped with two LDOs which can achieve high-density mounting.