Applications
* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.037 0.95 interface between the board and the package. With the correct pad geometry, the packages will self align when sub
Datasheet Details
Part number:
BAV70LT3, BAV70LT1
Manufacturer:
File Size:
77.76 KB
Description:
(bav70lt1 / bav70lt3) monolithic dual switching diode common cathode.
Note:
This datasheet PDF includes multiple part numbers: BAV70LT3, BAV70LT1.
Please refer to the document for exact specifications by model.
BAV70LT3 Distributors
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