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PCGLA200T75NF8 200A Field Stop Trench IGBT

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Description

DIE DATA SHEET www.onsemi.com Field Stop Trench IGBT Die 750 V, 200 A PCGLA200T75NF8 VCES = 750 V IC = Limited by Tj(max) IGBT DIE .

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Features

* AEC
* Q101 Rev. D Qualified for Enhanced Reliability
* Maximum Junction Temperature 175°C
* Advanced FS4 Trench Technology
* Positive Temperature Coefficient
* Easy Paralleling
* Short Circuit Rated
* Very Low Saturation Voltage: VCE(SA

Applications

* Applications
* Automotive Traction Modules
* General Power Modules DIE OUTLINE MECHANICAL PARAMETERS Parameter Mils mm Die Size 394 x 394 10,000 x 10,000 Emitter Pad Size See chip drawing See chip drawing Gate Pad Size 47 x 56 1,200 x 1,430 Scribe Lane Width 3 80 Di

PCGLA200T75NF8 Distributors

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📌 All Tags

PCGLA200T75NF8 200A Field Stop Trench IGBT ON Semiconductor
ON Semiconductor PCGLA200T75NF8-like datasheet
PCGA200T65NF8M1