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MMBFJ309 JFET VHF/UHF Amplifier Transistor

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Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBFJ309LT1/D JFET VHF/UHF Amplifier Transistor N *Channel 3 GATE MMBFJ309LT1.

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Datasheet Specifications

Part number
MMBFJ309
Manufacturer
ON
File Size
165.44 KB
Datasheet
MMBFJ309_ONSemiconductor.pdf
Description
JFET VHF/UHF Amplifier Transistor

Features

* the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.
* The soldering temperature and time shall not exceed 260°C for more than 10 seconds.
* When shifting from preheating t

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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