GMZ3.3 Features
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA
* Case: Molded Glass MICRO-MELF
* Terminals: Solderabl
Datasheet Details
GMZ3.3, GMZ2.0
PAN JIT
325.10 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: GMZ3.3, GMZ2.0.
Please refer to the document for exact specifications by model.
GMZ3.3 Distributor
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