GMZ3.6
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Case: Molded Glass MICRO-MELF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.01 grams
- Polarity : Color band denotes cathode end
- Packing information
