GS1001FL
Key Features
- For surface mounted applications in order to optimize board space
- Low profile package
- Ideal for automated placement
- High temperature soldering : 260°C /10 seconds at terminals
- Glass Passivated Chip Junction
- Lead free in pliance with EU RoHS 2011/65/EU directive
- Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA
- Case: SOD-123FL,Molded plastic over passivated junction
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.0006 ounces, 0.0173grams
