AN17808B Datasheet - Panasonic

AN17808B Dual Audio Power Amplifier

Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi),.

Panasonic Semiconductor Singapore Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 28-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. Doc Title SDSC-PSE-AN17808B Product Specifications for AN17808B Revision History Total no. of pages (excluding this page.

AN17808B Datasheet (976.01 KB)