LQFP44 - PC board footprint
Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.800 P2 Ax Ay Bx By C 1.500 D1 0.500 D2 0.600 Gx Gy Hx Hy 0.850 13.300 13.300 10.300 10.300 10.500 10.500 13.550 13.550 SOT389-1_fp_reflow © Koninklijke Philips Electronics N.V.
2004.
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