RT3050 - high performance 384MHz MIPS24KEc CPU core

Product Overview

Ralink

Datasheet Details

Part number	RT3050
Manufacturer	Ralink
File Size	3.57 MB
Description	high performance 384MHz MIPS24KEc CPU core
Datasheet	RT3050 Datasheet
Additional preview pages of the RT3050 datasheet.

Product details

Description

7 1.1 289-Pins BGA Package Diagram 7 1.1.1 289-Pins BGA Package Diagram for RT3050F 7 1.1.2 289-Pins BGA Package Diagram for RT3052F 8 1.2 Pin Description 9 1.3 Pins Sharing Scheme 17 1.4 Boot strapping Signal description 21 2.

Features

 Embedded 2 T2R 2.4G CMOS RF  Embedded 802.11n 2T2R MAC/BBP w/MLD Order Information Part Number Temp Range Package 0 RT3050F -10~55 C Green/ RoHS Compliant TFBGA 289 ball (14mmx14mm) 0 RT3052F -10~55 C Green/ RoHS Compliant TFBGA 289 ball (14mmx14mm) Ralink Technology, Corp. (Taiwan) 5th F. No. 36,Taiyuan St, Jhubei City, Hsin-Chu, Taiwan, R. O. C. Tel: 886-3-560-0868 Fax: 886-3-560-0818 Ralink Technology, Corp. (USA) 20833 Stevens Creek Blvd. , Suite 200 Cupertino, CA95014 Tel: (408) 725-8070 F.

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Other Datasheets by Ralink

RT3050F - high performance 384MHz MIPS24KEc CPU core
RT3052F - high performance 384MHz MIPS24KEc CPU core
RT3070 - Highly integrated MAC/BBP and 2.4 GHz RF single chip

Published: Mar 11, 2014 |