Description
of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples.
Features
- Low Power consumption (Low reverse leak current) and high speed (Low capacitance).
- We can support the lineup of environmental friendly halogen free type on your demand.
- Ultra small Flat Lead Package (UFP) is suitable for compact and high-density surface mount design. Ordering Information
Part No RKD703KJ P RKD703KJ R Laser Mark R1 Package Name UFP Package Code PWSF0002ZA-A Taping Abbreviation (Quantity) P (4,000 pcs / reel) R (8,000 pcs / reel)
Pin Arrangement
Cathode mark Ma.
RKD703KJ_RenesasTechnology.pdf
