R5F213G4ANNP Datasheet | Renesas

Overview 1.1 Features The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system ponents. The R8C/3GA Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function. 1.1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer equipment, etc. REJ03B0235-0110 Rev.1.10 Sep. 10, 2009 Page 1 of 53 R8C/3GA Group 1. Overview 1.1.2 Specifications Tables 1.1 and 1.2 outline the Specifications for R8C/3GA Group. Table 1.1 Specifications for R8C/3GA Group (1) Item CPU Function Central processing R8C CPU core Specification unit - Number of fundamental instructions: 89 - Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V) 200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V) - Multiplier: 16 bits × 16 bits → 32 bits - Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits - Operation mode: Single-chip mode (address space: 1 Mbyte) Memory ROM, RAM, Data Refer to Table 1.3 Product List for R8C/3GA Group. flash Power Supply Voltage detection - Power-on reset Voltage circuit - Voltage detection 3 (detection level of voltage detection 0 and voltage Detection I/O Ports detection 1 selectable) Programmable I/O - Input-only: 1 pin Clock ports Clock generation circuits - CMOS I/O ports: 19, selectable pull-up resistor - High current drive ports: 19 - 3 circuits: XIN clock oscillation circuit, XCIN clock oscillation circuit (32 k Hz), Low-speed on-chip...