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PC123XNNSZ0F Photocoupler

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Description

PC123XNNSZ0F Series PC123XNNSZ0F DIP 4pin Reinforced Insulation Type Photocoupler Series * .
PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor.

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Datasheet Specifications

Part number
PC123XNNSZ0F
Manufacturer
SHARP
File Size
289.31 KB
Datasheet
PC123XNNSZ0F-SHARP.pdf
Description
Photocoupler

Features

* 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MI

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