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SiW1750 - Baseband Processor

Datasheet Summary

Features

  • Small footprint 132-pin BGA package (8 x 8 mm).
  • Fully compliant Bluetooth 1.1 component.
  • Low power 1.8 V core with flexible 1.8 V or 3.3 V I/O voltage.
  • Full piconet with 7 slaves support.
  • Scatternet support.
  • Full speed Bluetooth operation.
  • HCI UART and USB transport support.
  • CODEC interface for audio.

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Datasheet preview – SiW1750

Datasheet Details

Part number SiW1750
Manufacturer SILICON wave
File Size 233.89 KB
Description Baseband Processor
Datasheet download datasheet SiW1750 Datasheet
Additional preview pages of the SiW1750 datasheet.

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Full PDF Text Transcription

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® SiW1750 Baseband Processor Data Sheet Bluetooth™ Solutions 1 INTRODUCTION The SiW1750 Baseband Processor is part of Silicon Wave's second-generation solutions for Bluetooth™ wireless communications. The SiW1750 provides the essential Bluetooth baseband link control and link management that meets Bluetooth 1.1 specification in a digital system-on-chip (SoC) with integrated firmware up to the HCI. Combined with the SiW1701 or SiW1502 Radio Modem ICs, it provides a complete and cost effective hardware solution to integrate into products. 2 FEATURES • Small footprint 132-pin BGA package (8 x 8 mm). • Fully compliant Bluetooth 1.1 component. • Low power 1.8 V core with flexible 1.8 V or 3.3 V I/O voltage. • Full piconet with 7 slaves support. • Scatternet support.
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