SO14 Datasheet (ST Microelectronics)

SO14, SO 14

® Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.20 mm 10-40 µm molding compound 1.65 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data SO 14 Rth(j-a) (ºC/W) 220 die size = 60 x 90 sq.mils 1) 200 180 floating in air 160 mounted on : 140 SM PCB1A SGS b