Part number:
SDIP30
Manufacturer:
File Size:
53.16 KB
Description:
Sdip30 thermal data.
Thermal Data www.DataSheet4U.com
SDIP 30
30 leads
PACKAGE MATERIAL LIST
item #
leadframe die attach
molding compound
material
copper epoxy glu.
SDIP30
53.16 KB
Sdip30 thermal data.
Thermal Data www.DataSheet4U.com
SDIP 30
30 leads
PACKAGE MATERIAL LIST
item #
leadframe die attach
molding compound
material
copper epoxy glu.
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