SDIP30
Description
Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.25 mm...
- Part: SDIP30
- Description: SDIP30 Thermal Data
- Manufacturer: STMicroelectronics
- Size: 53.16 KB
Datasheets by Manufacturer
| Part Number | Manufacturer | Description |
|---|---|---|
| NJW1185 | New Japan Radio | Audio Processor / SDIP32 |