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SDIP30 Datasheet - STMicroelectronics

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SDIP30 SDIP30 Thermal Data

 Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glu.

SDIP30_STMicroelectronics.pdf

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Datasheet Details

Part number:

SDIP30

Manufacturer:

STMicroelectronics ↗

File Size:

53.16 KB

Description:

SDIP30 Thermal Data

SDIP30 Distributors

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SDIP30 SDIP30 Thermal Data STMicroelectronics
STMicroelectronics SDIP30-like datasheet