Datasheet Details
| Part number | SDIP30 |
|---|---|
| Manufacturer | STMicroelectronics |
| File Size | 53.16 KB |
| Description | SDIP30 Thermal Data |
| Datasheet |
 SDIP30 Datasheet
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| Part number | SDIP30 |
|---|---|
| Manufacturer | STMicroelectronics |
| File Size | 53.16 KB |
| Description | SDIP30 Thermal Data |
| Datasheet |
SDIP30 Datasheet
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Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.
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