Part number:
SDIP30
Manufacturer:
File Size:
53.16 KB
Download:
📄 Download SDIP30 Datasheet PDF
Description:
Sdip30 thermal data.
Thermal Data www.DataSheet4U.com
SDIP 30
30 leads
PACKAGE MATERIAL LIST
item #
leadframe die .
attach
molding compound
material
copper epoxy glue ( silver filler ) epoxy resin
thickness 0.25 mm.