SDIP30 Datasheet (STMicroelectronics)

SDIP30, SDIP30 Thermal Data

 Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.25 mm 10-40 µm 3.8 mm thermal conductivity 2.61 W/cm°C 0.01 W/cm°C 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Rth(j-a) (ºC/W) 75 1) 70 65 SDIP 30 www.DataSheet4U.com die size 160x80 sq.

mils mounted on a low K board (1s 1 Oz.)