CL31Bxxxx - Multilayer Ceramic Capacitor

This page provides the datasheet information for the CL31Bxxxx, a member of the CL31B224KBFANNE Multilayer Ceramic Capacitor family.

Datasheet Summary

Description

※ Please Consult us for other termination type.

Samsung Electronics

📥 Download Datasheet

Datasheet Details

Part number	CL31Bxxxx
Manufacturer	Samsung Electronics
File Size	574.63 KB
Description	Multilayer Ceramic Capacitor
Datasheet	CL31Bxxxx Datasheet
Additional preview pages of the CL31Bxxxx datasheet.

📁 Similar Datasheet

CL31B102MBCNBN - Array Type Capacitors (Samsung)
CL31B103MBCNBN - Array Type Capacitors (Samsung)
CL31B104KACNBN - Array Type Capacitors (Samsung)
CL31B104KOCNBN - Array Type Capacitors (Samsung)
CL31B105KAHNNNE - Multi-layer Ceramic Capacitor (Samsung)
CL31B105KBHNNNF - Multi-layer Ceramic Capacitor (Samsung)
CL31B106KAHNNNE - Multi-layer Ceramic Capacitor (Samsung)
CL31B106KPHN3NE - Multi-layer Ceramic Capacitor (Samsung semiconductor)
CL31B153KBCNBN - Array Type Capacitors (Samsung)
CL31B473KACNBN - Array Type Capacitors (Samsung)

Other Datasheets by Samsung Electronics

CL31B224KBFANNE - Multilayer Ceramic Capacitor
CL31Fxxxxxxxxx - Multilayer Ceramic Capacitor
CL31xxxxxxxx - Multilayer Ceramic Capacitor
CL32A226KPJNNNE - Multilayer Ceramic Capacitor

Full PDF Text Transcription

Click to expand full text

Multilayer Ceramic Capacitor www.DataSheet4U.com Multilayer Ceramic Capacitor ■ INTRODUCTION MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the better frequency characteristics, higher reliability, higher withstanding voltage and so on. MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode), which reduced the total cost of MLCC. This inner electrode is connected to outer termination for surface mounting, which is composed of three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer.

Published: Mar 24, 2006 |