KAG00J007M-FGG2 Datasheet (Samsung Electronics)

KAG00J007M-FGG2, MCP Memory

The KAG00J007M is a Multi Chip Package Memory which combines 512Mbit Nand Flash Memory(organized with two pieces of 256Mbit Nand Flash Memory) and 256Mbit synchronous high data rate Dynamic RAM.

512Mbit NAND Flash memory is organized as 64M x8 bits and 256Mbit SDRAM is organized as 4M x16 bits x4 ba

www.DataSheet4U.com KAG00J007M-FGG2 Advance Preliminary MCP MEMORY MCP Specification of 256Mb NAND 2 and 256Mb Mobile SDRAM -1- Revision 0.6 October 2003 www.DataSheet4U.com KAG00J007M-FGG2 Document Title Advance Preliminary MCP MEMORY Multi-Chip Package MEMORY 256M Bit(32Mx8) Nand Flash 2 / 256M Bit(4Mx16x4Banks) Mobile SDRAM Revision History Revision No.

History 0.0 Initial issue.

(512M NAND DDP C-Die_ Ver 1.0) ( 256M MSDRAM E‘-Die_Ver 0.5) - Added Column address : page 37 -

KAG00J007M-FGG2 Features

* and specifications including FAQ, please refer to Samsung’s web site. http://samsungelectronics.com/semiconductors/products/products_index.html The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMS