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K4B1G1646C, K4B1G0446C 1Gb C-die DDR3 SDRAM

K4B1G1646C Description

K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PRO.
11 5.

K4B1G1646C Features

* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag

K4B1G1646C Applications

* where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.

📥 Download Datasheet

This datasheet PDF includes multiple part numbers: K4B1G1646C, K4B1G0446C. Please refer to the document for exact specifications by model.
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Datasheet Details

Part number
K4B1G1646C, K4B1G0446C
Manufacturer
Samsung semiconductor
File Size
1.30 MB
Datasheet
K4B1G0446C_Samsungsemiconductor.pdf
Description
1Gb C-die DDR3 SDRAM
Note
This datasheet PDF includes multiple part numbers: K4B1G1646C, K4B1G0446C.
Please refer to the document for exact specifications by model.

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1Gb C-die DDR3 SDRAM Samsung semiconductor
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