- Part: K4B1G1646C
- Description: 1Gb C-die DDR3 SDRAM
- Manufacturer: Samsung Semiconductor
- Size: 1.30 MB
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K4B1G1646C Key Features
- 4 3.0 Package pinout/Mechanical Dimension & Addressing
- 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls)
- 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls)
- 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls)
- 7 3.4 FBGA Package Dimension (x4)
- 8 3.5 FBGA Package Dimension (x8)
- 9 3.6 FBGA Package Dimension (x16)
- 10 4.0 Input/Output Functional Description
Other K4B1G1646C Datasheets
| Manufacturer |
Part Number |
Description |
Samsung Semiconductor |
K4B1G1646E
|
1Gb E-die DDR3 SDRAM |
|
Samsung Semiconductor |
K4B1G1646G
|
1Gb G-die DDR3 SDRAM |
|
Samsung Semiconductor |
K4B1G1646I
|
1Gb I-die DDR3 SDRAM |
