CIB10P330

Chip Bead

Samsung

CIB10P330 Features

* Perfect shape for automatic mounting, with no directionality.

* Excellent solderability and high heat resistance for either flow or reflow soldering

* Monolithic inorganic material construction for high reliability

* Closed magnetic circuit configuration avoids crosstalk and is sui

CIB10P330 General Description

Part no. CIB10P100 CIB10P220 CIB10P260 CIB10P300 CIB10P330 CIM10U800 CIM10U121 CIM10U221 CIM10U241 CIM10U301 CIM10U471 CIM10U601 CIM10U102 CIM10U202 CIB10J300 CIM10J400 CIM10J470 CIM10J600 CIM10J750 CIM10J800 CIM10J121 CIM10J151 CIM10J221 CIM10J241 Thickness (mm) 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15.

CIB10P330 Datasheet (750.18 KB)

CIB10P330 Datasheet Preview — Preview of CIB10P330 PDF

Datasheet Details

Part number:

CIB10P330

Manufacturer:

Samsung

File Size:

750.18 KB

Description:

Chip bead.
Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers.

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TAGS

CIB10P330 Chip Bead Samsung

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CIB10P330 Features

CIB10P330 General Description

Datasheet Details

File Size:

Description:

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