* 6 3.0 PACKAGE CONFIGURATIONS 7 3.1 153 Ball Pin Configuration 7 3.1.1 11.5mm x 13mm x 1.0mm Package Dimension 8 3.2 169 Ball Pin Configuration 9 3.2.1 12mm x 16mm x 1.0mm Package Dimension 10 3.2.2 12mm x 16mm x 1.2mm Package Dimension 11 3.3 Product Architecture 12 4.0 e.MMC 4.41 features 13 4
KLM8G2FE3B-B001 Datasheet (1.12 MB)
KLM8G2FE3B-B001
Samsung
1.12 MB
E.mmc.
Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE.
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