* 4 3.0 PACKAGE CONFIGURATIONS 5 3.1 153 Ball Pin Configuration 5 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension 6 3.2 Product Architecture 7 4.0 e.MMC 5.0 feature 8 4.1 HS400 mode 8 5.0 Technical Notes 10 5.1 S/W Agorithm 10 5.1.1 Partition Management 10 5.1.1.1 Boot Area Partition and RPMB A
KLMAG2WEPD-B031 Datasheet (481.32 KB)
KLMAG2WEPD-B031
Samsung
481.32 KB
Emmc.
SAMSUNG CONFIDENTIAL
Rev. 1.0 Aug. 2014
KLMxGxxEPD-B031
Samsung e
*MMC Product family
e.MMC 5.0 Specification compatibility
SAMSUNG
datasheetgl@tec.
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